Publications

5 results for H. Gan

Characterization of micro-bump C4 interconnects for Si-carrier SOP applications
- - S.L. Wright
  - R.J. Polastre
  - et al.
- 2006
- ECTC 2006
Conference paper
Pb-free micro-joints (50 μm pitch) for the next generation micro-systems: The fabrication, assembly and characterization
- - H. Gan
  - S.L. Wright
  - et al.
- 2006
- ECTC 2006
Conference paper
System-on-Package (SOP) technology, characterization and applications
- - J. Knickerbocker
  - P. Andry
  - et al.
- 2006
- ECTC 2006
Conference paper
3-D silicon integration and silicon packaging technology using silicon through-vias
- - John U. Knickerbocker
  - Chirag S. Patel
  - et al.
- 2006
- IEEE Journal of Solid-State Circuits
Paper
Three dimensional silicon integration using fine pitch interconnection, silicon processing and silicon carrier packaging technology
- - John U. Knickerbocker
  - Chirag S. Patel
  - et al.
- 2005
- CICC 2005
Conference paper