Foamed elastomers for packaging interconnections, testing and burn-in applications
- Yun-Hsin Liao
- D.Y. Shih
- et al.
- 1996
- MRS Fall Meeting 1996
Conference paper
Publications
35 results for Paul Lauro
New ball grid array module test sockets
- D.Y. Shih
- Paul Lauro
- et al.
- 1996
- ECTC 1996
Conference paperAdhesion test standardization for multichip module packages
- D.Y. Shih
- J. Kim
- et al.
- 1995
- ECTC 1995
Conference paperPolyimide stress cushion for multichip glass-ceramic module packaging
- D.Y. Shih
- P. Palmateer
- et al.
- 1995
- ECTC 1995
Conference paperNovel elastomeric connector for packaging interconnections, testing and burn-in applications
- D.Y. Shih
- Brian Beaman
- et al.
- 1995
- ECTC 1995
Conference paper