Publications

6 results for Matthew Shoudy

Novel Advanced Low-k Dielectric for 2 nm and Beyond Cu and Post Cu Dual Damascene BEOL Interconnect Technologies
- - S. Nguyen
  - H. Huang
  - et al.
- 2025
- VLSI Technology and Circuits 2025
Conference paper
Innovations Enabling the Continued Extendibility of Cu and Post-Cu Damascene BEOL Technologies
- - D. Edelstein
  - A. Jog
  - et al.
- 2025
- IITC 2025
Conference paper
Evaluation of different metal preclean conditions for MOL for 2nm and beyond: Topic/category: AEPM : nt Processes and Materials
- - Samuel Munnangi
  - Andrew Simon
  - et al.
- 2024
- ASMC 2024
Conference paper
Subtractive Ru Interconnect Enabled by Novel Patterning Solution for EUV Double Patterning and TopVia with Embedded Airgap Integration for Post Cu Interconnect Scaling
- - C. J. Penny
  - Koichi Motoyama
  - et al.
- 2022
- IEDM 2022
Conference paper
In-situ preclean run path impact on selective cobalt cap deposition and electromigration
- - Matthew Shoudy
  - Hosadurga Shobha
  - et al.
- 2020
- ASMC 2020
Conference paper
Extreme-low k porous pSiCOH dielectrics prepared by PECVD
- - H. You
  - Petra Mennell
  - et al.
- 2018
- JVSTB
Paper