Electrodeposition of bismuth thin films on n-GaAs (110)
- Philippe M. Vereecken
- Kenneth Rodbell
- et al.
- 2005
- Applied Physics Letters
Paper
Publications
20 results for P. M. Vereecken
The chemistry of additives in damascene copper plating
- Philippe M. Vereecken
- Robert A. Binstead
- et al.
- 2005
- IBM J. Res. Dev
PaperIntegration of direct plating of Cu onto a CVD Ru liner
- S. Malhotra
- D. Canaperi
- et al.
- 2004
- AMC 2004
Conference paperUniform copper electroplating on resistive substrates
- Rui Fang
- Keisuke Namiki
- et al.
- 2004
- ECS Meeting 2004
Conference paperLiner materials for direct electrodeposition of Cu
- M.W. Lane
- C.E. Murray
- et al.
- 2003
- Applied Physics Letters
PaperDynamic microscopy of nanoscale cluster growth at the solid-liquid interface
- M.J. Williamson
- R.M. Tromp
- et al.
- 2003
- Nature Materials
PaperElectrodeposition of Bi1-xSbx thin films
- P.M. Vereecken
- S. Ren
- et al.
- 2003
- JES
PaperKinetics of particle codeposition of nanocomposites
- I. Shao
- P.M. Vereecken
- et al.
- 2002
- JES
PaperIn situ transmission electron microscopy of copper electrodeposition
- Frances M. Ross
- Mark J. Williamson
- et al.
- 2002
- Microscopy and Microanalysis
PaperSynthesis and characterization of particle-reinforced Ni/Al2O3 nanocomposites
- I. Shao
- P.M. Vereecken
- et al.
- 2002
- Journal of Materials Research
Paper