Plasma etch challenges with new EUV lithography material introduction for patterning for MOL and BEOL
- Changwoo Lee
- Bhaskar Nagabhirava
- et al.
- 2015
- SPIE Advanced Lithography 2015
Conference paper
Publications
18 results for Bassem Hamieh
Trench and hole patterning with EUV resists using dual frequency capacitively coupled plasma (CCP)
- Yannick Feurprier
- Katie Lutker-Lee
- et al.
- 2015
- SPIE Advanced Lithography 2015
Conference paper10nm FINFET technology for low power and high performance applications
- D. Guo
- H. Shang
- et al.
- 2014
- ICSICT 2014
Conference paperEnabling reverse tone imaging for via levels using attenuated Phase Shift Mask and source optimization
- Bassem Hamieh
- Hyun Chol Choi
- et al.
- 2013
- SPIE Advanced Lithography 2013
Conference paperHigh performance bulk planar 20nm CMOS technology for low power mobile applications
- Huiling Shang
- Sameer Jain
- et al.
- 2012
- VLSI Technology 2012
Conference paperCompetitive and cost effective copper/low-k interconnect (BEOL) for 28 nm CMOS technologies
- R. Augur
- C. Child
- et al.
- 2012
- Microelectronic Engineering
PaperCompetitive and cost effective copper/low-k interconnect (BEOL) for 28nm CMOS technologies
- Rod Augur
- Craig Child
- et al.
- 2010
- ADMETA 2010
Conference paperC-Quad polarized illumination for back end thin wire: Moving beyond annular illumination regime
- Sohan Singh Mehta
- Hyung-Rae Lee
- et al.
- 2009
- SPIE Advanced Lithography 2009
Conference paper