Evaluation of High NA EUV for Subtractive Interconnect Patterning in Advanced Nodes
- Chris Penny
- Joe Lee
- et al.
- 2026
- SPIE Advanced Lithography + Patterning 2026
Conference paper
Publications
6 results for Nicholas Latham
Metal-Oxide Resist Develop Method Down-Select and Process Optimization
- Nicholas Latham
- Belle Antonovich
- et al.
- 2026
- SPIE Advanced Lithography + Patterning 2026
Conference paperAccelerating High NA EUV Lithography Insertion for Interconnect Scaling and Beyond: Performance, Cost, and Future Prospects
- Luciana Meli
- Indira Seshadri
- et al.
- 2025
- SPIE Advanced Lithography + Patterning 2025
Conference paperHigh Volume Manufacturing Innovations for Metal-Oxide Resist Patterning
- Nicholas Latham
- Jennifer Church
- et al.
- 2025
- SPIE Advanced Lithography + Patterning 2025
Conference paperFully subtractive Ru Topvia interconnects with minimum 9 nm-space airgap for RC performance and reliability enhancement as post-Cu interconnects
- Koichi Motoyama
- Jaemyung Choi
- et al.
- 2024
- IEDM 2024
Conference paperAI-Powered Process Optimization for EUV MOR: Equipment Trace Data Feature Extraction and Machine Learning is Essential for CD Control
- Mario Faria
- Francis Ortega
- et al.
- 2024
- ASMC 2024
Paper