Thermomechanical FEM Analysis of Sn-Bi Solder Joint During Temperature Cycling for Fine Pitch 1st Level Interconnect
- Toyohiro Aoki
- Yasuharu Yamada
- et al.
- 2025
- ICEP-IAAC 2025
Conference paper
Publications
2 results for Yasuharu Yamada
Scalable Advanced DBHi Chiplet Package Using Silicon Bridge With 30 μm-Pitch Solder Joints
- Akihiro Horibe
- Takahito Watanabe
- et al.
- 2024
- ECTC 2024
Conference paper