Publications

2 results for Sze Pei Lim

Thermomechanical FEM Analysis of Sn-Bi Solder Joint During Temperature Cycling for Fine Pitch 1st Level Interconnect
- - Toyohiro Aoki
  - Yasuharu Yamada
  - et al.
- 2025
- ICEP-IAAC 2025
Conference paper
Effect of Interfacial Wetting on First Level Interconnect Joint Formation For Low Temperature Solders-iNEMI Project
- - Shripad Gokhale
  - Edvin Cetegen
  - et al.
- 2025
- ICEP-IAAC 2025
Conference paper