Assembly and packaging of non-bumped 3D chip stacks on bumped substrates
- Bing Dang
- Joana Maria
- et al.
- 2014
- ECTC 2014
Conference paper
Publications
33 results for Jae Woong Nah
Wafer IMS (Injection molded solder) - A new fine pitch solder bumping technology on wafers with solder alloy composition flexibility
- Jae Woong Nah
- Jeffrey Gelorme
- et al.
- 2014
- ECTC 2014
Conference paperFlip chip assembly method employing differential heating/cooling for large dies with coreless substrates
- Katsuyuki Sakuma
- Edmund Blackshear
- et al.
- 2013
- ECTC 2013
Conference paperWafer level underfill for area array Cu pillar flip chip packaging of ultra low-k chips on organic substrates
- Jae-Woong Nah
- Michael Gaynes
- et al.
- 2012
- ECTC 2012
Conference paperThree-dimensional a-Si:H solar cells on glass nanocone arrays patterned by self-assembled Sn nanospheres
- Jeehwan Kim
- Augustin J. Hong
- et al.
- 2011
- ACS Nano
PaperHigh performance wafer level underfill material with high filler loading
- Satoru Katsurayama
- Hiroshi Suzuki
- et al.
- 2011
- ECTC 2011
Conference paperDevelopment of wafer level underfill materials and assembly processes for fine pitch Pb-free solder flip chip packaging
- Jae-Woong Nah
- Michael A. Gaynes
- et al.
- 2011
- ECTC 2011
Conference paperMask and mask-less injection molded solder (IMS) technology for fine pitch substrate bumping
- Jae-Woong Nah
- Peter A. Gruber
- et al.
- 2010
- IMAPS 2010
Conference paperInjection molded solder - a new fine pitch substrate bumping method
- Jae-Woong Nah
- Peter A. Gruber
- et al.
- 2009
- ECTC 2009
Conference paperC4NP Cu-cored Pb-free flip chip interconnections
- Jae-Woong Nah
- Stephen L. Buchwalter
- et al.
- 2008
- ECTC 2008
Conference paper