Fully subtractive Ru Topvia interconnects with minimum 9 nm-space airgap for RC performance and reliability enhancement as post-Cu interconnects
- Koichi Motoyama
- Jaemyung Choi
- et al.
- 2024
- IEDM 2024
Conference paper
Publications
5 results for Hosadurga Shobha
Backside power distribution for nanosheet technologies beyond 2nm
- Ruilong Xie
- Wonhyuk Hong
- et al.
- 2024
- VLSI Technology and Circuits 2024
Conference paperA novel single damascene process for via metal corrosion-free interconnects in advanced nodes
- Koichi Motoyama
- Dominik Metzler
- et al.
- 2024
- IITC 2024
Conference paperEUV Double Patterning Solution for Subtractive Metal Patterning at 18nm Pitch
- Chris Penny
- Koichi Motoyama
- et al.
- 2024
- SPIE Advanced Lithography + Patterning 2024
Invited talkFlowable Chemical Vapor Deposition of Lightly Porous Low k SiCOH Dielectrics—Remote Plasma Deposition Processing, Film Analysis and Gap-Fill Application in Nano Device Fabrication
- Son Nguyen
- Thomas Haigh
- et al.
- 2022
- MRS Fall Meeting 2022
Talk