Publications

204 results for Christian Lavoie

Microstructural analysis of copper interconnections using picosecond ultrasonics
- - James M.E. Harper
  - Sandra G. Malhotra
  - et al.
- 2000
- Materials Research Society Symposium-Proceedings
Paper
Thermal stability and oxygen-loss characteristics of Pt(O) films prepared by reactive sputtering
- - K.L. Saenger
  - C. Cabral Jr.
  - et al.
- 1999
- Journal of Applied Physics
Paper
Phase formation and resistivity in the ternary system Ti-Nb-Si
- - Aliette Mouroux
  - Marylène Roux
  - et al.
- 1999
- Journal of Applied Physics
Paper
The future of silicide for CMOS contacts
- - R.A. Roy
  - C. Cabral Jr.
  - et al.
- 1999
- MRS Spring Meeting 1999
Conference paper
Classification of the modes of dissociation in immiscible Cu-alloy thin films
- - K. Barmak
  - G.A. Lucadamo
  - et al.
- 1999
- MRS Spring Meeting 1999
Conference paper
Mechanisms for enhanced C54-TiSi₂ formation in Ti-Ta alloy films on single-crystal Si
- - A. Quintero
  - M. Libera
  - et al.
- 1999
- Journal of Materials Research
Paper
Interdiffusion studies of single crystal TiN/NbN superlattice thin films
- - C. Engström
  - J. Birch
  - et al.
- 1999
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Paper
Evidence of a two-stage reaction mechanism in sputter deposited Nb/Al multilayer thin-films studied by in situ synchrotron X-ray diffraction
- - G.A. Lucadamo
  - K. Barmak
  - et al.
- 1999
- Materials Letters
Paper
In situ characterization of titanium silicide formation: The effect of Mo interlayer, temperature ramp-rate, and annealing atmosphere
- - S.-L. Zhang
  - C. Lavoie
  - et al.
- 1999
- Journal of Applied Physics
Paper
Enhanced thermal stability of C49 TiSi₂ in the presence of aluminum
- - S.-L. Zhang
  - F.M. D'Heurle
  - et al.
- 1998
- Applied Physics Letters
Paper