Manufacturing Yield Improvement for Advanced CMOS Technology Middle-of-Line Interconnect with Cobalt Metallization : YE: YieldEnhancement/Learning
- Susan Fan
- P. Jamison
- et al.
- 2023
- ASMC 2023
Conference paper
Publications
3 results for C.B. Peethala
Selective deposition of AlOx for Fully Aligned Via in nano Cu interconnects
- Son Van Nguyen
- Hosadurga Shobha
- et al.
- 2021
- IITC 2021
Conference paperFully aligned via integration for extendibility of interconnects to beyond the 7 nm node
- Benjamin D. Briggs
- C.B. Peethala
- et al.
- 2017
- IEDM 2017
Conference paper