Effects of overlayers on electromigration reliability improvement for Cu/low K interconnects
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- D. Canaperi
- et al.
- 2004
- IRPS 2004
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- L. Gignac
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- 2004
- Applied Physics Letters
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- C.-K. Hu
- D. Canaperi
- et al.
- 2004
- IRPS 2004
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- R.D. Goldblatt
- B.N. Agarwala
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- IITC 2000
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