A novel integration scheme for self-aligend Ru topvia as post-Cu alternative metal interconnects
- K. Motoyama
- D. Metzler
- et al.
- 2023
- IITC/MAM 2023
Conference paper
Publications
4 results for Lijuan Zou
Subtractive Ru Interconnect Enabled by Novel Patterning Solution for EUV Double Patterning and TopVia with Embedded Airgap Integration for Post Cu Interconnect Scaling
- C. J. Penny
- Koichi Motoyama
- et al.
- 2022
- IEDM 2022
Conference paperEUV single exposure via patterning at aggressive pitch
- Jing Guo
- Jennifer Church
- et al.
- 2021
- SPIE Advanced Lithography 2021
Conference paperParticle reduction in back end of line plasma-etching process: CFM: Contamination free manufacturing
- Lijuan Zou
- Alex Vaghese
- et al.
- 2018
- ASMC 2018
Conference paper