Enhanced electrical and thermal interconnects by the selfassembly of nanoparticle necks utilizing capillary bridging
- Thomas Brunschwiler
- Gerd Schlottig
- et al.
- 2013
- InterPACK 2013
Conference paper
Publications
37 results for Gerd Schlottig
Integration of intra chip stack fluidic cooling using thin-layer solder bonding
- Yassir Madhour
- Michael Zervas
- et al.
- 2013
- 3DIC 2013
Conference paperHybrid porous media and fluid domain modeling strategy to optimize a novel staggered fin heat sink design
- Ningkang Li
- Gerd Schlottig
- et al.
- 2013
- THERMINIC 2013
Conference paperInvestigation of novel solder patterns for power delivery and heat removal support
- Thomas Brunschwiler
- Yassir Madhour
- et al.
- 2013
- ECTC 2013
Conference paperFormulation of percolating thermal underfills using hierarchical self-assembly of micro- and nanoparticles by centrifugal forces and capillary bridging
- Thomas Brunschwiler
- Gerd Schlottig
- et al.
- 2012
- IMAPS 2012
Conference paperDirected self-assembly of nanoparticles for novel electrical interconnects
- Yu Liu
- Gerd Schlottig
- et al.
- 2012
- ESTC 2012
Conference paperA multivariate parameter analysis of copper pillars eases the design of denser interconnects
- Gerd Schlottig
- Thomas Brunschwiler
- et al.
- 2012
- EuroSimE 2012
Conference paper