Local measurements of flow boiling heat transfer on hot spots In 3D compatible radial microchannels
- Fanghao Yang
- Mark D. Schultz
- et al.
- 2015
- InterPACK 2015
Conference paper
Publications
41 results for Michael Gaynes
Embedded two-phase cooling of large 3D compatible chips with radial channels
- Mark D. Schultz
- Fanghao Yang
- et al.
- 2015
- InterPACK 2015
Conference paperHigh performance packaging laminates enable buses for exascale systems
- Lei Shan
- Young Kwark
- et al.
- 2015
- DesignCon 2015
Conference paperAssembly and packaging of non-bumped 3D chip stacks on bumped substrates
- Bing Dang
- Joana Maria
- et al.
- 2014
- ECTC 2014
Conference paperTime, temperature, and mechanical fatigue dependence on underfill adhesion
- Joseph Cremaldi
- Michael Gaynes
- et al.
- 2014
- ECTC 2014
Conference paperPreparing 25Gbps electrical I/O for exascale computing systems
- Lei Shan
- Young Kwark
- et al.
- 2014
- ECTC 2014
Conference paperExperimental investigation of direct attach microprocessors in a Liquid-Cooled chiller-less Data Center
- Mark Schultz
- Michael Gaynes
- et al.
- 2014
- ITherm 2014
Conference paperDynamically controlled long duration operation of a highly energy efficient chiller-less data center test facility
- Milnes P. David
- Pritish R. Parida
- et al.
- 2013
- InterPACK 2013
Conference paperSystem-level design for liquid cooled chiller-less data center
- Pritish R. Parida
- Timothy Chainer
- et al.
- 2012
- IMECE 2012
Conference paperAdvanced flexible CMOS integrated circuits on plastic enabled by controlled spalling technology
- Davood Shahrjerdi
- Stephen W. Bedell
- et al.
- 2012
- IEDM 2012
Conference paper