High-efficiency thin-film InGaP/(In)GaAs/Ge multijunction solar cells enabled by controlled spalling technology
- Davood Shahrjerdi
- Stephen W. Bedell
- et al.
- 2012
- PVSC 2012
Conference paper
Publications
41 results for Michael Gaynes
Wafer level underfill for area array Cu pillar flip chip packaging of ultra low-k chips on organic substrates
- Jae-Woong Nah
- Michael Gaynes
- et al.
- 2012
- ECTC 2012
Conference paperImpact of operating conditions on a chiller-less data center test facility with liquid cooled servers
- Milnes P. David
- Madhusudan K. Iyengar
- et al.
- 2012
- ITherm 2012
Conference paperExperimental investigation of water cooled server microprocessors and memory devices in an energy efficient chiller-less data center
- Pritish R. Parida
- Milnes David
- et al.
- 2012
- SEMI-THERM 2012
Conference paperExperimental characterization of an energy efficient chiller-less data center test facility with warm water cooled servers
- Milnes P. David
- Madhusudan Iyengar
- et al.
- 2012
- SEMI-THERM 2012
Conference paperHigh-efficiency thin-film InGaP/InGaAs/Ge tandem solar cells enabled by controlled spalling technology
- Davood Shahrjerdi
- Stephen W. Bedell
- et al.
- 2012
- Applied Physics Letters
PaperVacuum underfill technology for advanced packaging (IMPACT 2011)
- M. Hoshiyama
- M. Hasegawa
- et al.
- 2011
- IMPACT 2011
Conference paperVacuum underfill technology for advanced packaging
- Akihiro Horibe
- M.-C. Paquet
- et al.
- 2011
- ECTC 2011
Conference paperHigh performance wafer level underfill material with high filler loading
- Satoru Katsurayama
- Hiroshi Suzuki
- et al.
- 2011
- ECTC 2011
Conference paperDevelopment of wafer level underfill materials and assembly processes for fine pitch Pb-free solder flip chip packaging
- Jae-Woong Nah
- Michael A. Gaynes
- et al.
- 2011
- ECTC 2011
Conference paper