Publications

41 results for Michael Gaynes

Analysis and evaluation methods associated with the application of compliant thermal interface materials in multi-chip electronic board assemblies
- - John Torok
  - Shawn Canfield
  - et al.
- 2011
- SEM Annual Conference on Experimental and Applied Mechanics 2011
Conference paper
Using in situ capacitance measurements to monitor the stability of thermal interface materials in complex PCB assemblies
- - Michael Gaynes
  - Timothy Chainer
  - et al.
- 2010
- IMAPS 2010
Conference paper
Delamination mechanisms of thermal interface materials in organic packages during reflow and moisture soaking
- - Jiantao Zheng
  - Virendra Jadhav
  - et al.
- 2009
- ECTC 2009
Conference paper
The over-bump applied resin wafer-level underfill process: Process, material and reliability
- - Claudius Feger
  - Nancy LaBianca
  - et al.
- 2009
- ECTC 2009
Conference paper
A practical implementation of silicon microchannel coolers for high power chips
- - Evan G. Colgan
  - Bruce Furman
  - et al.
- 2007
- IEEE Transactions on Components and Packaging Technologies
Paper
High performance and subambient silicon microchannel cooling
- - E.G. Colgan
  - B.K. Furman
  - et al.
- 2006
- Journal of Heat Transfer
Paper
High performance and sub-ambient silicon microchannel cooling
- - E.G. Colgan
  - B.K. Furman
  - et al.
- 2006
- ICNMM 2006
Conference paper
Silicon microchannel cooling for high power chips
- - Evan G. Colgan
  - Bruce Furman
  - et al.
- 2006
- HVAC and R Research
Paper
A practical implementation of silicon microchannel coolers for high power chips
- - E.G. Colgan
  - B.K. Furman
  - et al.
- 2005
- SEMI-THERM 2005
Conference paper
Effects of mechanical stress and moisture on packaging interfaces
- - Stephen L. Buchwalter
  - Peter J. Brofman
  - et al.
- 2005
- IBM J. Res. Dev
Paper