A CMOS Compatible Monolithic Fiber Attach Solution with Reliable Performance and Self-Alignment
- Bo Peng
- Tymon Barwicz
- et al.
- 2020
- OFC 2020
Conference paper
Publications
2 results for Brittany Hedrick
Defect mitigation of plasma-induced delamination of TiW/Cu from SiNx layer in thin si interposer processing with glass carriers
- Vijay Sukumaran
- Thuy Tran-Quinn
- et al.
- 2015
- ECTC 2015
Conference paper