Organic Multi-Chip Module for high performance systems
- Lei Shan
- Young Kwark
- et al.
- 2015
- ECTC 2015
Conference paper
Publications
45 results for Timothy Chainer
Embedded two-phase cooling of large 3D compatible chips with radial channels
- Mark D. Schultz
- Fanghao Yang
- et al.
- 2015
- InterPACK 2015
Conference paperThermal design of a hierarchical radially expanding cavity for two-Phase cooling of integrated circuits
- Arvind Sridhar
- Chin Lee Ong
- et al.
- 2015
- InterPACK 2015
Conference paperEulerian multiphase conjugate model for chip-embedded microchannel flow boiling
- Pritish R. Parida
- Hsin-Hua Tsuei
- et al.
- 2015
- InterPACK 2015
Conference paperLocal measurements of flow boiling heat transfer on hot spots In 3D compatible radial microchannels
- Fanghao Yang
- Mark D. Schultz
- et al.
- 2015
- InterPACK 2015
Conference paperHigh performance packaging laminates enable buses for exascale systems
- Lei Shan
- Young Kwark
- et al.
- 2015
- DesignCon 2015
Conference paperPreparing 25Gbps electrical I/O for exascale computing systems
- Lei Shan
- Young Kwark
- et al.
- 2014
- ECTC 2014
Conference paperExperimental investigation of direct attach microprocessors in a Liquid-Cooled chiller-less Data Center
- Mark Schultz
- Michael Gaynes
- et al.
- 2014
- ITherm 2014
Conference paperCooling energy reduction during dynamically controlled data center operation
- Pritish R. Parida
- Timothy J. Chainer
- et al.
- 2013
- InterPACK 2013
Conference paperDynamically controlled long duration operation of a highly energy efficient chiller-less data center test facility
- Milnes P. David
- Pritish R. Parida
- et al.
- 2013
- InterPACK 2013
Conference paper