Characterization of TSV etch from a sustainability standpoint
- Osakpolo Isowamwen
- Nathan Marchack
- et al.
- 2023
- SPIE Advanced Lithography 2023
Conference paper
Publications
3 results for Scott Lefevre
Control of sidewall roughness formation in through-silicon via etch at non-cryogenic temperatures
- John M. Papalia
- Devi Koty
- et al.
- 2022
- SPIE Advanced Lithography 2022
Conference paperDSA patterning options for logics and memory applications
- Chi Chun Liu
- Elliott Franke
- et al.
- 2017
- SPIE Advanced Lithography 2017
Conference paper