Critical ultra low-k TDDB reliability issues for advanced CMOS technologies
- F. Chen
- M. Shinosky
- et al.
- 2009
- IRPS 2009
Conference paper
Publications
32 results for Matthew Angyal
Interconnect performance and scaling strategy for the 22 nm node and beyond
- James H.-C. Chen
- Lijun Jiang
- et al.
- 2008
- ADMETA 2008
Conference paperTechnology elements of a common platform bulk foundry offering (invited)
- P. Gilbert
- A. Steegen
- et al.
- 2007
- IEDM 2007
Conference paperCharacterization, Modeling and Extraction of Cu Wire Resistance for 65 nm Technology
- Ning Lu
- M. Angyal
- et al.
- 2007
- CICC 2007
Conference paperA SiCOH BEOL interconnect technology for high density and high performance 65 nm CMOS applications
- Matthew Angyal
- Jason Gill
- et al.
- 2005
- AMC 2005
Conference paperBEOL process integration with Cu/SiCOH (k=2.8) low-k interconnects at 65nm groundrules
- S. Lane
- M. Fukasawa
- et al.
- 2005
- AMC 2005
Conference paperBEOL process integration with Cu/SiCOH (k=2.8) low-k interconnects at 65 nm groundrules
- M. Fukasawa
- S. Lane
- et al.
- 2005
- IITC 2005
Conference paperLow-k/copper integration scheme suitable for ULSI manufacturing from 90nm to 45nm nodes
- T. Nogami
- S. Lane
- et al.
- 2005
- Optics East 2005
Conference paperHigh performance 65 nm SOI technology with dual stress liner and low capacitance SRAM cell
- E. Leobandung
- H. Nayakama
- et al.
- 2005
- VLSI Technology 2005
Conference paperLower-k SiCOH integration for 65 nm ground rules
- T. Nogami
- S. Lane
- et al.
- 2005
- VMIC 2005
Conference paper