Effect of microstructure and alloy doping on electromigration in Pb-free solder interconnect
- Minhua Lu
- 2013
- IIRW 2013
Conference paper
Publications
46 results for Minhua Lu
The dependence of the Sn grain structure of Pb-free solder joints on composition and geometry
- Gregory Parks
- Babak Arfaei
- et al.
- 2012
- ECTC 2012
Conference paperEffect of Joule heating on electromigration reliability of Pb-free interconnect
- Minhua Lu
- Steven L. Wright
- et al.
- 2012
- ECTC 2012
Conference paperStudy of interfacial reaction and electromigration reliability of Pb-free solders with nickel iron barrier layer
- Minhua Lu
- Paul Lauro
- et al.
- 2011
- InterPACK 2011
Conference paperEffect of microstructure on electromigration in Pb-free solder interconnect
- Minhua Lu
- 2010
- International Workshop STRESS-INDUCED PHENOMENA IN METALLIZATION 2010
Conference paperComparison of electromigration behaviors of SnAg and SnCu solders
- Minhua Lu
- Da-Yuan Shih
- et al.
- 2009
- IRPS 2009
Conference paperThe effects of Ag, Cu compositions and Zn doping on the electromigration performance of pb-free solders
- Minhua Lu
- Da-Yuan Shih
- et al.
- 2009
- ECTC 2009
Conference paperEffect of Zn doping on SnAg solder microstructure and electromigration stability
- Minhua Lu
- Da-Yuan Shih
- et al.
- 2009
- Journal of Applied Physics
PaperBlech effect in Pb-free flip chip solder joint
- Minhua Lu
- Da-Yuan Shih
- et al.
- 2009
- Applied Physics Letters
PaperChip to carrier C4 technology challenges with Pb-free solders
- Eric D. Perfecto
- Brian Sundlof
- et al.
- 2008
- CICC 2008
Conference paper