Fabrication and characterization of robust through-silicon vias for silicon-carrier applications
- Paul S. Andry
- Cornelia K. Tsang
- et al.
- 2008
- IBM J. Res. Dev
Paper
Publications
28 results for Edmund Sprogis
Wafer-level 3D integration technology
- Steven J. Koester
- Albert M. Young
- et al.
- 2008
- IBM J. Res. Dev
ReviewThree-dimensional silicon integration
- John U. Knickerbocker
- Paul S. Andry
- et al.
- 2008
- IBM J. Res. Dev
Review3D chip stacking technology with low-volume lead-free interconnections
- K. Sakuma
- P. Andry
- et al.
- 2007
- ECTC 2007
Conference paperAssembly, characterization, and reworkability of Pb-free ultra-fine pitch C4s for system-on-package
- B. Dang
- S.L. Wright
- et al.
- 2007
- ECTC 2007
Conference paperCMOS-compatible through silicon vias for 3D process integration
- Cornelia K. Tsang
- Paul S. Andry
- et al.
- 2006
- MRS Fall Meeting 2006
Conference paperSystem-on-Package (SOP) technology, characterization and applications
- J. Knickerbocker
- P. Andry
- et al.
- 2006
- ECTC 2006
Conference paperA CMOS-compatible process for fabricating electrical through-vias in silicon
- P. Andry
- C. Tsang
- et al.
- 2006
- ECTC 2006
Conference paperCharacterization of micro-bump C4 interconnects for Si-carrier SOP applications
- S.L. Wright
- R.J. Polastre
- et al.
- 2006
- ECTC 2006
Conference paperPb-free micro-joints (50 μm pitch) for the next generation micro-systems: The fabrication, assembly and characterization
- H. Gan
- S.L. Wright
- et al.
- 2006
- ECTC 2006
Conference paper