Publications

2 results for S.S. Bouchard

The projection of the incidence of dielectric cracking during chip joining with lead free solder bumps
- - Thomas M. Shaw
  - Xiao Hu Liu
  - et al.
- 2016
- IRPS 2016
Conference paper
The strength of BEOL structures fabricated using low K materials and its impact on CPI failures
- - Thomas M. Shaw
  - Xiao Hu Liu
  - et al.
- 2015
- IIRW 2015
Conference paper