Review on Percolating and Neck-Based Underfills for Three-Dimensional Chip Stacks
- Thomas Brunschwiler
- Jonas Zürcher
- et al.
- 2016
- ASME Journal of Electronic Packaging
Review
Publications
6 results for Florian Schindler-Saefkow
Review of percolating and neck-based underfills with thermal conductivities up to 3 W/m-K
- Thomas Brunschwiler
- Jonas Zürcher
- et al.
- 2016
- ITherm 2016
Conference paperMaster curve synthesis by effective viscoelastic plastic material modeling
- Florian Schindler-Saefkow
- Remi Pantou
- et al.
- 2016
- EuroSimE 2016
Conference paperAdvances in percolated thermal underfill (PTU) simulations for 3D-integration
- Sridhar Kumar
- Uwe Zschenderlein
- et al.
- 2015
- EuroSimE 2015
Conference paperStudy of the compound of properties of percolating and neck-based thermal underfills
- Thomas Brunschwiler
- Florian Schindler-Saefkow
- et al.
- 2014
- ITherm 2014
Conference paperSequentially formed underfills: Thermo-mechanical properties of underfills at full filler percolation
- Gerd Schlottig
- Florian Schindler-Saefkow
- et al.
- 2013
- EPTC 2013
Conference paper