Reduced electromigration of Cu wires by surface coating
- C.-K. Hu
- L. Gignac
- et al.
- 2002
- Applied Physics Letters
Paper
Publications
61 results for Robert Rosenberg
Electromigration in on-chip single/dual damascene Cu interconnections
- C.-K. Hu
- L. Gignac
- et al.
- 2002
- JES
PaperBimodal electromigration mechanisms in dual-damascene Cu line/via on W
- C.-K. Hu
- L. Gignac
- et al.
- 2002
- IITC 2002
Conference paperThe effect of current density, stripe length, stripe width, and temperature on resistance saturation during electromigration testing
- R. Filippi
- R.A. Wachnik
- et al.
- 2002
- Journal of Applied Physics
PaperMechanisms for very long electromigration lifetime in dual-damascene Cu interconnections
- C.-K. Hu
- L. Gignac
- et al.
- 2001
- Applied Physics Letters
PaperCopper metallization for high performance silicon technology
- R. Rosenberg
- D. Edelstein
- et al.
- 2000
- Annual Review of Materials Science
PaperScaling effect on electromigration in on-chip Cu wiring
- C.-K. Hu
- R. Rosenberg
- et al.
- 1999
- IITC 1999
Conference paperElectromigration path in Cu thin-film lines
- C.-K. Hu
- R. Rosenberg
- et al.
- 1999
- Applied Physics Letters
PaperCopper migration and precipitate dissolution in aluminum/copper lines during electromigration testing
- T.M. Shaw
- C.-K. Hu
- et al.
- 1996
- MRS Spring Meeting 1996
Conference paperThe microstructural stability of Al(Cu) lines during electromigration
- T.M. Shaw
- C.-K. Hu
- et al.
- 1995
- Applied Physics Letters
Paper