3D chip stacking technology with low-volume lead-free interconnections
- K. Sakuma
- P. Andry
- et al.
- 2007
- ECTC 2007
Conference paper
Publications
67 results for Sung K. Kang
Critical factors affecting the undercooling of Pb-free, flip-chip solder bumps and in-situ observation of solidification process
- Sung K. Kang
- Moon Gi Cho
- et al.
- 2007
- ECTC 2007
Conference paperEffects of minor additions of Zn on interfacial reactions of Sn-Ag-Cu and Sn-Cu solders with various Cu substrates during thermal aging
- Moon Gi Cho
- Sung K. Kang
- et al.
- 2007
- Journal of Electronic Materials
PaperStudy of the undercooling of Pb-free, flip-chip solder bumps and in situ observation of solidification process
- Sung K. Kang
- M.G. Cho
- et al.
- 2007
- Journal of Materials Research
PaperPb-free micro-joints (50 μm pitch) for the next generation micro-systems: The fabrication, assembly and characterization
- H. Gan
- S.L. Wright
- et al.
- 2006
- ECTC 2006
Conference paperThe influence of low level doping on the thermal evolution of SAC alloy solder joints with Cu pad structures
- Isabel De Sousa
- Donald W. Henderson
- et al.
- 2006
- ECTC 2006
Conference paperInterfacial reactions of Sn-Ag-Cu solders modified by minor Zn alloying addition
- Sung K. Kang
- Donovan Leonard
- et al.
- 2006
- Journal of Electronic Materials
PaperEffect of intermetallics spalling on the mechanical behavior of electroless Ni(P)/Pb-free solder interconnection
- Yoon-Chul Sohn
- Jin Yu
- et al.
- 2005
- ECTC 2005
Conference paperMicrostructure and mechanical properties of lead-free solders and solder joints used in microelectronic applications
- Sung K. Kang
- Paul A. Lauro
- et al.
- 2005
- IBM J. Res. Dev
PaperThe oxidation of lead-free Sn alloys by electrochemical reduction analysis
- Sungil Cho
- Jin Yu
- et al.
- 2005
- JOM
Paper