Publications

67 results for Sung K. Kang

Development of conductive adhesive materials for via fill applications
- - Sung K. Kang
  - Stephen L. Buchwalter
  - et al.
- 2001
- IEEE Transactions on Components and Packaging Technologies
Paper
Interfacial reaction studies on lead (Pb)-free solder alloys
- - S.K. Kang
  - D.Y. Shih
  - et al.
- 2001
- ECTC 2001
Conference paper
Characterization of electroplated bismuth-tin alloys for electrically conducting materials
- - S.K. Kang
  - Stephen L. Buchwalter
  - et al.
- 2000
- Journal of Electronic Materials
Paper
Development of conductive adhesive materials for via fill applications
- - Sung K. Kang
  - Stephen L. Buchwalter
  - et al.
- 2000
- Proceedings - Electronic Components and Technology Conference
Paper
Pb-free solder alloys for flip chip applications
- - S.K. Kang
  - J. Horkans
  - et al.
- 1999
- ECTC 1999
Conference paper
Development of conducting adhesive materials for microelectronic applications
- - Sung K. Kang
  - S. Purushothaman
- 1999
- Journal of Electronic Materials
Paper
Development of lead (Pb)-free interconnection materials for microelectronics
- - Sung K. Kang
- 1999
- Metals and Materials International
Paper
Development of low cost, low temperature conductive adhesives
- - S.K. Kang
  - S. Purushothaman
- 1998
- ECTC 1998
Conference paper
Development of high conductivity lead (Pb)-free conducting adhesives
- - Sung K. Kang
  - Rajinder S. Rai
  - et al.
- 1998
- IEEE Transactions on Components Packaging and Manufacturing Technology Part A
Paper
Study of interfacial reactions between tin and copper by differential scanning calorimetry
- - S.K. Kang
  - S. Purushothaman
- 1998
- Journal of Electronic Materials
Paper