An investigation of microstructure and microhardness of Sn-Cu and Sn-Ag solders as functions of alloy composition and cooling rate
- Sun-Kyoung Seo
- Sung K. Kang
- et al.
- 2008
- Journal of Electronic Materials
Paper
Publications
13 results for Hyuck Mo Lee
Undercooling and microhardness of Pb-free solders on various under bump metallurgies
- Moon Gi Cho
- Sung K. Kang
- et al.
- 2008
- Journal of Materials Research
PaperEffects of minor additions of Zn on interfacial reactions of Sn-Ag-Cu and Sn-Cu solders with various Cu substrates during thermal aging
- Moon Gi Cho
- Sung K. Kang
- et al.
- 2007
- Journal of Electronic Materials
Paper