In situ study of void growth kinetics in electroplated Cu lines
- E. Liniger
- L. Gignac
- et al.
- 2002
- Journal of Applied Physics
Paper
Publications
145 results for Lynne Gignac
Electromigration in on-chip single/dual damascene Cu interconnections
- C.-K. Hu
- L. Gignac
- et al.
- 2002
- JES
PaperBimodal electromigration mechanisms in dual-damascene Cu line/via on W
- C.-K. Hu
- L. Gignac
- et al.
- 2002
- IITC 2002
Conference paperHigh-quality aluminum oxide gate dielectrics by ultra-high-vacuum reactive atomic-beam deposition
- S. Guha
- E. Cartier
- et al.
- 2001
- Journal of Applied Physics
PaperElectromigration in AlCu lines: Comparison of Dual Damascene and metal reactive ion etching
- R. Filippi
- M. Gribelyuk
- et al.
- 2001
- Thin Solid Films
PaperStable ultrahigh-density magneto-optical recordings using introduced linear defects
- L. Krusin-Elbaum
- T. Shibauchi
- et al.
- 2001
- Nature
PaperMechanisms for very long electromigration lifetime in dual-damascene Cu interconnections
- C.-K. Hu
- L. Gignac
- et al.
- 2001
- Applied Physics Letters
PaperHigh coercivity of ultra-high-density ordered Co nanorod arrays
- T. Shibauchi
- L. Krusin-Elbaum
- et al.
- 2001
- Journal of Magnetism and Magnetic Materials
PaperDynamics of one-dimensional domain walls interacting with disorder potential
- L. Krusin-Elbaum
- T. Shibauchi
- et al.
- 2001
- Journal of Magnetism and Magnetic Materials
PaperThe microstructure of submicrometer wide planar-reactive ion etched versus trench-damascene AlCu lines
- K.P. Rodbell
- L. Gignac
- et al.
- 2000
- Journal of Applied Physics
Paper