Extendibility of NiPt silicide to the 22-nm node CMOS technology
- Kazuya Ohuchi
- Christian Lavoie
- et al.
- 2008
- IWJT 2008
Conference paper
Publications
145 results for Lynne Gignac
Backscattered electron imaging in the scanning electron microscope: The use of either: (A) high incident energy or (b) an array detector
- L. Gignac
- O.C. Wells
- et al.
- 2008
- Microscopy and Microanalysis
PaperElectromigration reliability of advanced interconnects
- C.-K. Hu
- L. Gignac
- et al.
- 2007
- International Workshop on Stress-Induced Phenomena in Metallization 2007
Conference paperExtendibility of NiPt silicide contacts for CMOS technology demonstrated to the 22-nm node
- Kazuya Ohuchi
- Christian Lavoie
- et al.
- 2007
- IEDM 2007
Conference paperComparison of electromigration in Cu interconnects with atomic-layer- or physical-vapor-deposited TaN liners
- C.-K. Hu
- L. Gignac
- et al.
- 2007
- JES
PaperImpact of Cu microstructure on electromigration reliability
- C.-K. Hu
- L. Gignac
- et al.
- 2007
- IITC 2007
Conference paperLow dielectric constant nanocomposite thin films based on silica nanoparticle and organic thermosets
- Qinghuang Lin
- Stephen A. Cohen
- et al.
- 2007
- Journal of Polymer Science, Part B: Polymer Physics
PaperUse of backscattered electron detector arrays for forming backscattered electron images in the scanning electron microscope
- Oliver C. Wells
- L. Gignac
- et al.
- 2006
- Scanning
PaperPhysical, electrical, and reliability characterization of Ru for Cu interconnects
- C.-C. Yang
- T. Spooner
- et al.
- 2006
- IITC 2006
Conference paperTunable Workfunction for Fully Silicied Gates (FUSI) and Proposed Mechanisms
- Y.-H. Kim
- C. Cabral Jr.
- et al.
- 2006
- VLSI-TSA 2006
Conference paper