Publications

2 results for Akira Takaguchi

Development and commercialization of solder bump fabrication technology with molten solder injection method
- - Toyohiro Aoki
  - Kazushige Toriyama
  - et al.
- 2015
- J. Jpn. Inst. Electron. Packag.
Paper
Wafer IMS (Injection molded solder) - A new fine pitch solder bumping technology on wafers with solder alloy composition flexibility
- - Jae Woong Nah
  - Jeffrey Gelorme
  - et al.
- 2014
- ECTC 2014
Conference paper