Large Feature Wafer Level In-Line Optical Metrology Techniques for Advanced Packaging Schemes
- Katherine Sieg
- Chris Bottoms
- et al.
- 2024
- SPIE Advanced Lithography + Patterning 2024
Conference paper
Publications
19 results for Daniel Schmidt
In-Line Metrology Requirements and Needs for Leading-Edge Technology
- Daniel Schmidt
- 2023
- TechConnect 2023
Invited talkHigh-NA EUV Exposure Tool Implications to Chip and Mask Layouts
- Daniel Schmidt
- 2023
- VLSI Technology 2023
Workshop paperHardware Based Performance Assessment of Vertical-Transport Nanosheet Technology
- Gen Tsutsui
- Seunghyun Song
- et al.
- 2022
- IEDM 2022
Invited talkScatterometry based methodologies for characterization of MRAM technology
- Manasa Medikonda
- Daniel Schmidt
- et al.
- 2022
- SPIE Advanced Lithography 2022
Conference paperDevelopment of SiGe Indentation Process Control for Gate-All-Around FET Technology Enablement
- Daniel Schmidt
- Aron Cepler
- et al.
- 2022
- IEEE Trans Semicond Manuf
PaperHighly Selective SiGe Dry Etch Process for the Enablement of Stacked Nanosheet Gate-All-Around Transistors
- Curtis Durfee
- Subhadeep Kal
- et al.
- 2021
- ECS Meeting 2021
Conference paperNanosheet Metrology Opportunities for Technology Readiness
- Mary Breton
- Daniel Schmidt
- et al.
- 2021
- SPIE Advanced Lithography 2021
Conference paperMeasuring Local CD Uniformity in EUV vias with scatterometry and machine learning
- Dexin Kong
- Daniel Schmidt
- et al.
- 2020
- SPIE Advanced Lithography 2020
Conference paper