Publications

3 results for Koushik Ramachandran

3D integration ESD protection design and analysis
- - Souvick Mitra
  - Ephrem Gebreselasie
  - et al.
- 2015
- EOS/ESD 2015
Conference paper
An enhanced thermo-compression bonding process to address warpage in 3D integration of large die on organic substrates
- - Katsuyuki Sakuma
  - Krishna Tunga
  - et al.
- 2015
- ECTC 2015
Conference paper
Bonding technologies for chip level and wafer level 3D integration
- - Katsuyuki Sakuma
  - Spyridon Skordas
  - et al.
- 2014
- ECTC 2014
Conference paper