Publications

10 results for Joe Lee

Evaluation of High NA EUV for Subtractive Interconnect Patterning in Advanced Nodes
- - Chris Penny
  - Joe Lee
  - et al.
- 2026
- SPIE Advanced Lithography + Patterning 2026
Conference paper
Metal-Oxide Resist Develop Method Down-Select and Process Optimization
- - Nicholas Latham
  - Belle Antonovich
  - et al.
- 2026
- SPIE Advanced Lithography + Patterning 2026
Conference paper
Exploring the Limits of Contact Hole Patterning with High NA EUV Lithography
- - Dario Goldfarb
  - Zheng Chen
  - et al.
- 2026
- SPIE Advanced Lithography + Patterning 2026
Talk
Accelerating High NA EUV Lithography Insertion for Interconnect Scaling and Beyond: Performance, Cost, and Future Prospects
- - Luciana Meli
  - Indira Seshadri
  - et al.
- 2025
- SPIE Advanced Lithography + Patterning 2025
Conference paper
High Volume Manufacturing Innovations for Metal-Oxide Resist Patterning
- - Nicholas Latham
  - Jennifer Church
  - et al.
- 2025
- SPIE Advanced Lithography + Patterning 2025
Conference paper
Fully subtractive Ru Topvia interconnects with minimum 9 nm-space airgap for RC performance and reliability enhancement as post-Cu interconnects
- - Koichi Motoyama
  - Jaemyung Choi
  - et al.
- 2024
- IEDM 2024
Conference paper
Backside power distribution for nanosheet technologies beyond 2nm
- - Ruilong Xie
  - Wonhyuk Hong
  - et al.
- 2024
- VLSI Technology and Circuits 2024
Conference paper
Plasma Processing and the Semiconductor Supply Chain in an Era of Low GWP and/or PFAS-Free Gas Chemistries
- - Eric A. Joseph
  - Brooke Tvermoes
  - et al.
- 2024
- CMC Conference 2024
Invited talk
EUV Double Patterning Solution for Subtractive Metal Patterning at 18nm Pitch
- - Chris Penny
  - Koichi Motoyama
  - et al.
- 2024
- SPIE Advanced Lithography + Patterning 2024
Invited talk
Etch and Patterning Development for 2nm Node Nanosheet Devices
- - Eric Miller
  - Indira Seshadri
  - et al.
- 2022
- SPIE Advanced Lithography 2022
Invited talk