Effective Media Approximation in Investigating Heat Transfer through Multiple Sandwiched Layers of BEOL Materials
- Amogh Wasti
- Zongmin Yang
- et al.
- 2025
- SHTC 2025
Conference paper
Publications
7 results for Aakrati Jain
A Multiscale Workflow for Thermal Analysis of 3DI Chip Stacks
- Max Bloomfield
- Amogh Wasti
- et al.
- 2025
- ITherm 2025
Conference paperExperimental Cross-Plane Thermal Transport Characterization of BEOL Materials and Sensitivity to In-Plane Thermal Transport
- Amogh Wasti
- Zongmin Yang
- et al.
- 2025
- ITherm 2025
Conference paperD2W and W2W Hybrid bonding system with below 2.5 micron pitch for 3D chiplet AI applications
- Katsuyuki Sakuma
- Roy Yu
- et al.
- 2024
- IEDM 2024
Invited talkDirect Bonded Heterogeneous Integration (DBHi): Surface Bridge Approach for Die Tiling
- Claudia Cristina Barrera Pulido
- Divya Taneja
- et al.
- 2023
- ECTC 2023
Short paperAnalytical Solution for a Chip Temperature Distribution in a Multilayer Chip-Package with Thermal Warpage
- Aakrati Jain
- Dishit Parekh
- et al.
- 2021
- ITherm 2021
Conference paperThermal Performance Characterization of Stacked Silicon Microcoolers for Spatially Non-Uniform Power Dissipation
- Aakrati Jain
- Dishit Parekh
- et al.
- 2021
- ITherm 2021
Conference paper