Fully subtractive Ru Topvia interconnects with minimum 9 nm-space airgap for RC performance and reliability enhancement as post-Cu interconnects
- Koichi Motoyama
- Jaemyung Choi
- et al.
- 2024
- IEDM 2024
Conference paper
Publications
5 results for Kangill Seo
Monolithic Stacked FET with Stepped Channels for Future Logic Technologies
- Chen Zhang
- Seungmin Song
- et al.
- 2024
- IEDM 2024
Conference paperBackside power distribution for nanosheet technologies beyond 2nm
- Ruilong Xie
- Wonhyuk Hong
- et al.
- 2024
- VLSI Technology and Circuits 2024
Conference paperVertical-Transport Nanosheet Technology for Scaling beyond the Lateral-Transport Devices CMOS Era
- Hemanth Jagannathan
- Susan Fan
- et al.
- 2023
- SSDM 2023
Invited talkHardware Based Performance Assessment of Vertical-Transport Nanosheet Technology
- Gen Tsutsui
- Seunghyun Song
- et al.
- 2022
- IEDM 2022
Invited talk