Publications

8 results for Chris Penny

Evaluation of High NA EUV for Subtractive Interconnect Patterning in Advanced Nodes
- - Chris Penny
  - Joe Lee
  - et al.
- 2026
- SPIE Advanced Lithography + Patterning 2026
Conference paper
Metal-Oxide Resist Develop Method Down-Select and Process Optimization
- - Nicholas Latham
  - Belle Antonovich
  - et al.
- 2026
- SPIE Advanced Lithography + Patterning 2026
Conference paper
Exploring the Limits of Contact Hole Patterning with High NA EUV Lithography
- - Dario Goldfarb
  - Zheng Chen
  - et al.
- 2026
- SPIE Advanced Lithography + Patterning 2026
Talk
A BKM by Analytical TEM to Effectively Characterize Electromigration Voids versus Grain Orientations in the Integration and Evaluation of Subtractive Ru BEOL Interconnect
- - Wayne Zhao
  - Yu Zhu
  - et al.
- 2025
- M&M 2025
Conference paper
Accelerating High NA EUV Lithography Insertion for Interconnect Scaling and Beyond: Performance, Cost, and Future Prospects
- - Luciana Meli
  - Indira Seshadri
  - et al.
- 2025
- SPIE Advanced Lithography + Patterning 2025
Conference paper
Fully subtractive Ru Topvia interconnects with minimum 9 nm-space airgap for RC performance and reliability enhancement as post-Cu interconnects
- - Koichi Motoyama
  - Jaemyung Choi
  - et al.
- 2024
- IEDM 2024
Conference paper
EUV Double Patterning Solution for Subtractive Metal Patterning at 18nm Pitch
- - Chris Penny
  - Koichi Motoyama
  - et al.
- 2024
- SPIE Advanced Lithography + Patterning 2024
Invited talk
Challenges and Innovations For Advanced BEOL Scaling at the 1nm Node and Beyond
- - Chris Penny
- 2023
- VLSI Technology 2023
Short course