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- Katsuyuki Sakuma
- Roy Yu
- et al.
- 2022
- ECTC 2022
Conference paper
Publications
3 results for Juan-Manuel Gomez
Functional Testing of AI Cores through Thinned 3D I/O Buffer Dies in 3D Die-Stacked Modules
- Mukta Farooq
- Arvind Kumar
- et al.
- 2022
- ECTC 2022
Conference paperA Laser Dicing Method for Plus-Shaped Dies for Heterogenous Integration Applications
- Aakrati Jain
- Kamal Sikka
- et al.
- 2022
- ECTC 2022
Conference paper