Publications

2 results for Siu Wing Lau

Voids-free Die-level Cu/ILD Hybrid bonding
- - Katsuyuki Sakuma
  - Roy Yu
  - et al.
- 2023
- ECTC 2023
Conference paper
Surface Energy Characterization for Die-Level Cu Hybrid Bonding
- - Katsuyuki Sakuma
  - Roy Yu
  - et al.
- 2022
- ECTC 2022
Conference paper