Characterization of Interfacial Fracture Strength in Hybrid Bonded Wafers: A Novel Approach for High-Resolution Spatial Profiling
- Sathya Raghavan
- Ben Yang
- et al.
- 2025
- ECTC 2025
Conference paper
Publications
7 results for Sathya Raghavan
Reliable Chiplet Integration on High Density Laminate (2.X D) for AI Hardware
- Divya Taneja
- Jonathan Grenier
- et al.
- 2024
- ECTC 2024
Conference paperModeling of the Temperature Profile and Residual Stress During Thermal Compression Bonding in 3D Packages
- Prabudhya Roy Chowdhury
- Sathya Raghavan
- et al.
- 2023
- ECTC 2023
Conference paperVoids-free Die-level Cu/ILD Hybrid bonding
- Katsuyuki Sakuma
- Roy Yu
- et al.
- 2023
- ECTC 2023
Conference paperThermal Characterization of 3-D Stacked Heterogeneous Integration (HI) Package for High-Power Computing Applications
- Aakrati Jain
- Risa Miyazawa
- et al.
- 2023
- ECTC 2023
Conference paperA Methodology to Optimize Laser Dicing Parameters to Maximize Dicing Quality Through Machine Learning
- Sathya Raghavan
- Aakrati Jain
- et al.
- 2023
- ECTC 2023
Conference paperThermo-mechanical Analysis of Thermal Compression Bonding Chip-Join Process
- Prabudhya Roy Chowdhury
- Katsuyuki Sakuma
- et al.
- 2022
- ECTC 2022
Conference paper