Self-Alignment of Active Si Bridge using Solder Joint Capillary Forces
- Thomas Lesueur
- David Danovitch
- et al.
- 2025
- ECTC 2025
Conference paper
Publications
5 results for Divya Taneja
Reliable Chiplet Integration on High Density Laminate (2.X D) for AI Hardware
- Divya Taneja
- Jonathan Grenier
- et al.
- 2024
- ECTC 2024
Conference paperScalable Advanced DBHi Chiplet Package Using Silicon Bridge With 30 μm-Pitch Solder Joints
- Akihiro Horibe
- Takahito Watanabe
- et al.
- 2024
- ECTC 2024
Conference paperThermo-mechanical Analysis of Thermal Compression Bonding Chip-Join Process
- Prabudhya Roy Chowdhury
- Katsuyuki Sakuma
- et al.
- 2022
- ECTC 2022
Conference paperCharacterization of Non-Conductive Paste Materials (NCP) for Thermocompression Bonding in a Direct Bonded Heterogeneously Integrated (DBHi) Si- Bridge Package
- Akihiro Horibe
- Takahito Watanabe
- et al.
- 2022
- ECTC 2022
Conference paper