IBM Telum: a 16-Core 5+ GHz DCM
- Ofer Geva
- Chris Berry
- et al.
- 2022
- ISSCC 2022
Conference paper
Publications
8 results for Hubert Harrer
Thermal power plane enabling dual-side electrical interconnects for high-performance chip stacks: Concept
- Thomas Brunschwiler
- Ralph Heller
- et al.
- 2014
- ESTC 2014
Conference paperCircuit and physical design of the zenterprise™ ec12 microprocessor chips and multi-chip module
- James Warnock
- Yuen Chan
- et al.
- 2014
- IEEE Journal of Solid-State Circuits
PaperSignal and power integrity (SPI) co-analysis for high-speed communication channels
- Renato Rimolo-Donadio
- Xiaomin Duan
- et al.
- 2013
- DesignCon 2013
Conference paper5.5GHz system z microprocessor and multi-chip module
- James Warnock
- Yuen H Chan
- et al.
- 2013
- ISSCC 2013
Conference paperFramework for co-simulation of signal and power integrity in server systems
- Thomas-Michael Winkel
- Hubert Harrer
- et al.
- 2012
- EPEPS 2012
Conference paperMethods for calculation of eye diagrams for digital links with multiple aggressors having unknown time offsets
- Dion Timmermann
- Renato Rimolo-Donadio
- et al.
- 2012
- SPI 2012
Conference paperFunctional high-speed characterization and modeling of a six-layer copper wiring structure and performance comparison with aluminum on-chip interconnections
- A. Deutsch
- H. Harrer
- et al.
- 1998
- IEDM 1998
Conference paper