Energy-efficient variable-flow liquid cooling in 3D stacked architectures
- Ayse K. Coskun
- David Atienza
- et al.
- 2010
- DATE 2010
Conference paper
Publications
201 results for Bruno Michel
Combined local microchannel-scale CFD modeling and global chip scale network modeling for electronics cooling design
- R. Wälchli
- Thomas Brunschwiler
- et al.
- 2010
- Int. J. Heat Mass Transf.
PaperHotspot-adapted cold plates to maximize system efficiency
- Thomas Brunschwiler
- Hugo Rothuizen
- et al.
- 2009
- THERMINIC 2009
Conference paperValidation of the porous-medium approach to model interlayer-cooled 3D-chip stacks
- T. Brunschwiler
- S. Paredes
- et al.
- 2009
- 3DIC 2009
Conference paperHotspot-optimized interlayer cooling in vertically integrated packages
- T. Brunschwiler
- Bruno Michel
- et al.
- 2008
- MRS Fall Meeting 2008
Conference paperA benchmark study on the thermal conductivity of nanofluids
- Jacopo Buongiorno
- David C. Venerus
- et al.
- 2009
- Journal of Applied Physics
PaperThermal rectification at water/functionalized silica interfaces
- Ming Hu
- Javier V. Goicochea
- et al.
- 2009
- Applied Physics Letters
PaperComparison of transient and static test methods for chip-to-sink thermal interface characterization
- B. Smith
- T. Brunschwiler
- et al.
- 2009
- Microelectronics Journal
PaperOn the thermal conductivity of gold nanoparticle colloids
- Natallia Shalkevich
- Werner Escher
- et al.
- 2009
- Langmuir
PaperEffect of inlet orifice on saturated CHF and flow visualization in multi-microchannel heat sinks
- Jung Eung Park
- John R. Thome
- et al.
- 2009
- SEMI-THERM 2009
Conference paper