Computational modeling of vortex shedding in water cooling of 3D integrated electronics
- Fabio Alfieri
- Manish K. Tiwari
- et al.
- 2013
- International Journal of Heat and Fluid Flow
Paper
Publications
201 results for Bruno Michel
Sequentially formed underfills: Thermo-mechanical properties of underfills at full filler percolation
- Gerd Schlottig
- Florian Schindler-Saefkow
- et al.
- 2013
- EPTC 2013
Conference paperIntegration of intra chip stack fluidic cooling using thin-layer solder bonding
- Yassir Madhour
- Michael Zervas
- et al.
- 2013
- 3DIC 2013
Conference paperRoadmap towards ultimately-efficient zeta-scale datacenters
- 2013
- HPCS 2013
Conference paperComputational modeling of hot-spot identification and control in 3-D stacked chips with integrated cooling
- Fabio Alfieri
- Sacha Gianini
- et al.
- 2013
- Numerical Heat Transfer; Part A: Applications
PaperAn experimentally optimized model for heat and mass transfer in direct contact membrane distillation
- Ólöf Andrjesdóttir
- Chin Lee Ong
- et al.
- 2013
- Int. J. Heat Mass Transf.
PaperMicrovortex-enhanced heat transfer in 3D-integrated liquid cooling of electronic chip stacks
- Adrian Renfer
- Manish K. Tiwari
- et al.
- 2013
- Int. J. Heat Mass Transf.
PaperAdvanced liquid cooling in HCPVT systems to achieve higher energy efficiencies
- S. Zimmermann
- H. Helmers
- et al.
- 2013
- CPV 2013
Conference paperRoadmap towards ultimately-efficient zeta-scale datacenters
- 2013
- DATE 2013
Conference paperVortex shedding from confined micropin arrays
- Adrian Renfer
- Manish K. Tiwari
- et al.
- 2013
- Microfluidics and Nanofluidics
Paper