Publications

4 results for Dominique Drouin

Analog Conductive-Metal-Oxide/HfO_x ReRAM Devices - BEOL Integration, Characterization and Modelling
- - Donato Francesco Falcone
  - Valeria Bragaglia
  - et al.
- 2024
- MRS Fall Meeting 2024
Talk
Comparison of sintering methodologies for 3D printed high-density interconnects (2.3 µm L/S) on organic substrates for high-performance computing applications
- - Shrivani Pandiya
  - Serge Ecoffey
  - et al.
- 2023
- ECTC 2023
Conference paper
Development of a Plasma Etching Process of Copper for the Microfabrication of High-Density Interconnects in Advanced Packaging
- - Juliano Borges
  - Maxime Darnon
  - et al.
- 2023
- ECTC 2023
Conference paper
1.65 µm L/S high density interconnect on organic substrate by advanced semi-additive process for HPC applications
- - Hussein Hamieh
  - Juliano Borges
  - et al.
- 2023
- ECTC 2023
Conference paper