Fully subtractive Ru Topvia interconnects with minimum 9 nm-space airgap for RC performance and reliability enhancement as post-Cu interconnects
- Koichi Motoyama
- Jaemyung Choi
- et al.
- 2024
- IEDM 2024
Conference paper
Publications
5 results for Koichi Motoyama
Backside power distribution for nanosheet technologies beyond 2nm
- Ruilong Xie
- Wonhyuk Hong
- et al.
- 2024
- VLSI Technology and Circuits 2024
Conference paperA novel single damascene process for via metal corrosion-free interconnects in advanced nodes
- Koichi Motoyama
- Dominik Metzler
- et al.
- 2024
- IITC 2024
Conference paperEUV Double Patterning Solution for Subtractive Metal Patterning at 18nm Pitch
- Chris Penny
- Koichi Motoyama
- et al.
- 2024
- SPIE Advanced Lithography + Patterning 2024
Invited talkExtension of Cu Interconnects and Considerations for Post-Cu Alternative Metals in Advanced Nodes
- Koichi Motoyama
- 2021
- VLSI Technology 2021
Short course