High-quality crystalline layer transfer from a silicon-on-insulator substrate onto a sapphire substrate using wafer bonding
- D. Singh
- L.T. Shi
- et al.
- 2003
- Journal of Electronic Materials
Paper
Publications
101 results for Steven J. Koester
Strained Si CMOS (SS CMOS) technology: Opportunities and challenges
- K. Rim
- R. Anderson
- et al.
- 2003
- Solid-State Electronics
Conference paperSub-30 nm P+ abrupt junction formation in strained Si/Si1-xGex MOS device
- K.L. Lee
- J.O. Chu
- et al.
- 2002
- IEDM 2002
Conference paperA comprehensive simulation study of strained-Si/SiGe nMODFET scaling for RF applications
- Qiqing Christine Ouyang
- S.J. Koester
- et al.
- 2002
- SISPAD 2002
Conference paperElectron and hole mobility enhancement in strained SOI by wafer bonding
- Lijuan Huang
- Jack O. Chu
- et al.
- 2002
- IEEE Transactions on Electron Devices
PaperCharacteristics and device design of sub-100 nm strained Si N- and PMOSFETs
- K. Rim
- J.O. Chu
- et al.
- 2002
- VLSI Technology 2002
Conference paperThermal stability of strained Si on relaxed Si1-xGex buffer layers
- P.M. Mooney
- S.J. Koester
- et al.
- 2001
- MRS Proceedings 2001
Conference paperEffect of thermal processing on strain relaxation and interdiffusion in Si/SiGe heterostructures studied using Raman spectroscopy
- S.J. Koester
- K. Rim
- et al.
- 2001
- Applied Physics Letters
PaperCarrier mobility enhancement in strained Si-On-Insulator fabricated by wafer bonding
- L.J. Huang
- J.O. Chu
- et al.
- 2001
- VLSI Technology 2001
Conference paperStrained Si NMOSFETs for high performance CMOS technology
- K. Rim
- S.J. Koester
- et al.
- 2001
- VLSI Technology 2001
Conference paper