Publications

2 results for Wei-Tsu Tseng

Fully subtractive Ru Topvia interconnects with minimum 9 nm-space airgap for RC performance and reliability enhancement as post-Cu interconnects
- - Koichi Motoyama
  - Jaemyung Choi
  - et al.
- 2024
- IEDM 2024
Conference paper
Metal Corrosion Mitigation in Fine Geometries during Chemical Mechanical Planarization
- - Wei-Tsu Tseng
  - Emiko Motoyama
  - et al.
- 2024
- ECS Spring Meeting 2024
Invited talk